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Sobre
Thermal paste, often referred to as thermal compound or thermal grease, is a critical material used in computer systems to improve the heat transfer between two surfaces. It is commonly applied between the central processing unit (CPU) or graphics processing unit (GPU) and their respective heatsinks. The primary function of thermal paste is to fill the microscopic gaps and imperfections on the surfaces of these components, ensuring maximum thermal conductivity and efficient heat dissipation. Without thermal paste, air pockets would form between the surfaces, significantly reducing the efficiency of heat transfer and potentially leading to overheating and system instability.
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